Jan 20, 2025 · Advanced packaging in flux. Nvidia’s foray into new technology is a stark reminder of how quickly advanced packaging needs are changing. Apparently, the semiconductor …

Jan 22, 2025 · According to Reuters, Nvidia has been selling Blackwell chips as fast as TSMC can produce them, but packaging has become a bottleneck due to limited capacity. …

Jan 31, 2024 · It is expected to join NVIDIA’s advanced packaging supply chain as early as the second quarter in 2024, grabbing a share of TSMC’s related orders. Industry sources cited by …

Jan 16, 2025 · Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced …

Jan 18, 2025 · In the broader context, Nvidia's shift to CoWoS-L is likely to accelerate the adoption of advanced packaging technologies across the semiconductor industry, setting new …

May 20, 2024 · Advanced multichip packaging substantially minimizes the semiconductor form factor, making it well suited for mobile devices, automotive computing, and generative artificial …

Jan 31, 2024 · Nvidia will start using Intel's Foveros packaging technology for some of its high-performance datacenter grade GPUs in Q2, according to a report.

May 6, 2024 · AMD and NVIDIA are both pumping out new generations of AI hardware, with the two GPU giants eating all of TSMC's advanced packaging capacity for not just 2024, but also …

Jan 31, 2024 · NVIDIA's supply of AI chips remains tight due to insufficient advanced packaging production capacity from key partner TSMC. As per the UDN report, NVIDIA will add Intel as a …

May 29, 2024 · Nvidia Corp (NASDAQ: NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the …