Each year, hundreds of thousands of people visit Arches National Park to go hiking in the summer months, hoping for long, ...

PENANG, Malaysia -- Top chip packaging provider ASE Technology Holding is investing $200 million to trial next-generation chip packaging technology built on square substrates, rather than ...

The U.S.-made chips, used in the defense, AI, automotive, aerospace and communications industries, aim to move packaging production away from Asia, according to the release. The center will ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

The establishment of ASE’s new chip packaging and testing facility marks a significant milestone, introducing cutting-edge technological capabilities to its decades-long operations in the state.

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

PENANG, Malaysia -- ASE Technology Holding on Tuesday opened what is set to become its largest overseas operations in Penang, Malaysia, as the world's biggest chip packaging and testing provider ...

Fan-out panel-level packaging is a cost-effective integrated circuit technology that enables multiple chips to be processed simultaneously on a larger panel, improving efficiency and reducing ...

Advanced chip packaging Advanced packaging technology is another key focus area for chip giants this year. Also known as back-end wafer processing, it is rising as a solution to overcome physical ...

The Trump White House is demanding that government workers hunt for words like “immigrant” and “diversity” in billions of ...