Intel has introduced a new Value Pack format for its processors with the aim of lowering costs. This new option is not ...
A new compostable material is being used by chip giant Frito-Lay to house its Sun Chips brand snack. The catch? It's really noisy.
tom's Hardware on MSN2d
ASE developing square packaging substrate tech to replace round wafersASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...
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