Each year, hundreds of thousands of people visit Arches National Park to go hiking in the summer months, hoping for long, ...

PENANG, Malaysia -- Top chip packaging provider ASE Technology Holding is investing $200 million to trial next-generation chip packaging technology built on square substrates, rather than ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

Fan-out panel-level packaging is a cost-effective integrated circuit technology that enables multiple chips to be processed simultaneously on a larger panel, improving efficiency and reducing ...

Ming-Chi Kuo writes in a post on X: Following Qualcomm, Broadcom’s Wi-Fi chips will also be replaced by Apple’s in-house chips at a faster pace. My latest industry survey indicates that all ...

Intel has introduced a new Value Pack format for its processors with the aim of lowering costs. This new option is not ...

ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with ...

Powered by two Nvidia Drive AGX Orin chips, the ES90 will be Volvo's most powerful car when it comes to computing capability, changing the limits of what can be achieved in AI-based safety ...

Microsoft said they created a computer chip that uses a new state of matter that will be capable of running the most powerful computers ever — a potential breakthrough for quantum computing that ...

The Wall Street Journal reports that two semiconductor chip makers—Taiwan Semiconductor Manufacturing Co. (TSMC) and Broadcom—are each weighing the possibility of buying part of Intel ...