Tesla, Meta, Microsoft are near buy points with Apple earnings also due. Will China's DeepSeek up-end AI stocks?

Broadcom, under CEO Hock Tan, now finds itself at the epicentre of one of the world’s fastest-growing markets — AI chips

Global spending on artificial intelligence (AI) is expected to remain solid in 2025, with market research firm IDC estimating that organizations are likely to pour $337 billion into this technology as they integrate AI tools into their business operations.

We recently published a list of 10 Best Stocks to Buy for High Returns in 2025. In this article, we are going to take a look at where Broadcom Inc.

The most popular is generally considered to be the Invesco QQQ ETF (NASDAQ: QQQ). What is the VanEck Semiconductor ETF? The VanEck Semiconductor ETF is the largest semiconductor ETF in the U.S., with $23 billion in assets under management.

Nvidia's AI dominance remains strong, but Barclays warns the semiconductor race is shifting--Marvell, Broadcom, and Lumentum are rising fast.

Nvidia CEO Jensen Huang stated that Samsung Electronics (Samsung) must develop a "new design" to pass Nvidia's qualification, sparking discussions about whether Samsung can make a comeback with HBM3E in 2025.

Solidigm extends deal with Broadcom to use high-capacity SSD controllers for AI and data-intensive workloads. Broadcom stock surged 92% in the last 12 months.

Google’s custom TPUs give it an edge over Nvidia. See why GOOG stock may outperform as it leads AI hardware innovation in a competitive big tech landscape.

Back in 2016, the Singapore-based chipmaker Avago acquired the original Broadcom. It inherited its brand, relocated its headquarters to the U.S., and expanded into the infrastructure software market by acquiring CA Technologies in 2018, Symantec's enterprise security unit in 2019, and the cloud software giant VMware in 2023.

Discover how the $500 billion AI infrastructure initiative by OpenAI, SoftBank, Oracle, and MGX is creating investment opportunities in multiple sectors.

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.