In today’s digital transformation era, the semiconductor industry is witnessing a fundamental shift toward chipset-based ...

In addition, the company proposed converting the Crolles 200mm fab to support Electrical Wafer Sorting, a high-volume manufacturing and advanced packaging technology. The focus will be on next ...

(Reuters) - Applied Materials has bought a 9% stake in BE Semiconductor industries (BESI), the U.S.-based computer chip ...

Taiwan Semiconductor Manufacturing Co. (TSMC), the worlds leading contract chipmaker, is nearing completion of a cutting-edge ...

It produces the world's most accurate hybrid bonding tool, a critical chip technology allowing two ... Unlike most semiconductor packaging steps, hybrid bonding occurs much closer to the chip's ...